DV74HCT245AN vs TC74HCT245AP feature comparison

DV74HCT245AN avg Semiconductors

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TC74HCT245AP Toshiba America Electronic Components

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Part Life Cycle Code Obsolete End Of Life
Ihs Manufacturer AVG SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL WITH DIRECTION CONTROL
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDIP-T20
Length 26.415 mm 24.6 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 33 ns 38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
Date Of Intro 1988-10-01
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
Max I(ol) 0.006 A
Package Equivalence Code DIP20,.3
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 28 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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