DV74HCT157AN
vs
MM74HCT157J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
AVG SEMICONDUCTORS
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
JESD-30 Code
R-PDIP-T16
R-XDIP-T16
Length
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
41 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.006 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
28 ns
Terminal Finish
Tin/Lead (Sn/Pb)
Compare DV74HCT157AN with alternatives