DV74ACT158N
vs
CD54ACT258HX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
AVG SEMICONDUCTORS
GE SOLID STATE
Part Package Code
DIP
Package Description
PLASTIC, DIP-16
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
ACT
ACT
JESD-30 Code
R-PDIP-T16
X-XUUC-N16
Length
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIE
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
IN-LINE
UNCASED CHIP
Propagation Delay (tpd)
8.5 ns
15.4 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Width
7.62 mm
Base Number Matches
1
1
Output Characteristics
3-STATE
Package Equivalence Code
DIE OR CHIP
Compare DV74ACT158N with alternatives
Compare CD54ACT258HX with alternatives