DTC124XET1
vs
MUN5130DW1T1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ON SEMICONDUCTOR
Package Description
SC-75, 3 PIN
CASE 419B-02, SC-70, SC-88, 6 PIN
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Additional Feature
BUILT IN BIAS RESISTOR RATIO 2.1364
BUILT-IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC)
0.1 A
0.1 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
SINGLE WITH BUILT-IN RESISTOR
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
80
3
JESD-30 Code
R-PDSO-G3
R-PDSO-G6
Number of Elements
1
2
Number of Terminals
3
6
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Polarity/Channel Type
NPN
PNP
Qualification Status
Not Qualified
Not Qualified
Surface Mount
YES
YES
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
5
Rohs Code
No
Part Package Code
SC-88
Pin Count
6
Manufacturer Package Code
CASE 419B-02
JESD-609 Code
e0
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
235
Power Dissipation-Max (Abs)
0.15 W
Terminal Finish
TIN LEAD