DSPIC33FJ64GP206AE/MR
vs
DSPIC33FJ32MC202T-E/SP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
QFN
DIP
Package Description
HVQCCN, LCC64,.35SQ,20
DIP,
Pin Count
64
28
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
Bit Size
16
16
Boundary Scan
YES
Clock Frequency-Max
40 MHz
40 MHz
External Data Bus Width
Format
FIXED POINT
Internal Bus Architecture
MULTIPLE
JESD-30 Code
S-PQCC-N64
R-PDIP-T28
JESD-609 Code
e3
e3
Length
9 mm
34.671 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Number of Terminals
64
28
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
DIP
Package Equivalence Code
LCC64,.35SQ,20
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100; TS 16949
Seated Height-Max
1 mm
5.08 mm
Supply Current-Max
90 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Matte Tin (Sn)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.5 mm
2.54 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
40
NOT SPECIFIED
Width
9 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Compare DSPIC33FJ64GP206AE/MR with alternatives
Compare DSPIC33FJ32MC202T-E/SP with alternatives