DSPIC33FJ64GP202E/SO
vs
DSPIC33FJ32MC802T-H/SP
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
SOP,
0.300 INCH, LEAD FREE, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
compliant
compliant
Has ADC
YES
Address Bus Width
Bit Size
16
16
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
YES
DMA Channels
YES
External Data Bus Width
JESD-30 Code
R-PDSO-G28
R-PDIP-T28
JESD-609 Code
e3
e3
Length
17.9 mm
34.671 mm
Moisture Sensitivity Level
1
Number of I/O Lines
21
Number of Terminals
28
28
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.65 mm
5.08 mm
Speed
40 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
Width
7.5 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Compare DSPIC33FJ64GP202E/SO with alternatives
Compare DSPIC33FJ32MC802T-H/SP with alternatives