DSPIC33EV64GM004-H/MR
vs
DSPIC33EV64GM004-I/PTVAO
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
,
|
TQFP-44
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Package Code |
QFP
|
TQFP
|
Technology |
CMOS
|
CMOS
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
3A991.A.2
|
Additional Feature |
|
A/D CONVERTERS IS ALSO AVAILABLE IN 24-CH 10-BIT, OPERATES UPTO 70MIPS
|
Address Bus Width |
|
|
Barrel Shifter |
|
YES
|
Bit Size |
|
16
|
Boundary Scan |
|
NO
|
Clock Frequency-Max |
|
40 MHz
|
External Data Bus Width |
|
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
NO
|
Internal Bus Architecture |
|
MULTIPLE
|
JESD-30 Code |
|
S-PQFP-G44
|
JESD-609 Code |
|
e3
|
Length |
|
10 mm
|
Low Power Mode |
|
YES
|
Number of DMA Channels |
|
4
|
Number of External Interrupts |
|
3
|
Number of Terminals |
|
44
|
Number of Timers |
|
9
|
On Chip Data RAM Width |
|
8
|
On Chip Program ROM Width |
|
8
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Equivalence Code |
|
TQFP44,.47SQ,32
|
Package Shape |
|
SQUARE
|
Package Style |
|
FLATPACK, THIN PROFILE
|
RAM (words) |
|
8192
|
ROM Programmability |
|
FLASH
|
Screening Level |
|
TS 16949
|
Seated Height-Max |
|
1.2 mm
|
Supply Current-Max |
|
60 mA
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Supply Voltage-Nom |
|
5 V
|
Surface Mount |
|
YES
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
MATTE TIN
|
Terminal Form |
|
GULL WING
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
QUAD
|
Width |
|
10 mm
|
|
|
|
Compare DSPIC33EV64GM004-H/MR with alternatives
Compare DSPIC33EV64GM004-I/PTVAO with alternatives