DSPIC33EV256GM002-M/MM
vs
DSPIC33EV256GM002T-I/SS
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
SSOP-28
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Package Code |
QFP
|
SSOP
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.A.2
|
| Has ADC |
|
YES
|
| Address Bus Width |
|
|
| Barrel Shifter |
|
YES
|
| Bit Size |
|
16
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
40 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
YES
|
| External Data Bus Width |
|
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Internal Bus Architecture |
|
MULTIPLE
|
| JESD-30 Code |
|
R-PDSO-G28
|
| Length |
|
10.2 mm
|
| Low Power Mode |
|
YES
|
| Number of DMA Channels |
|
4
|
| Number of External Interrupts |
|
3
|
| Number of I/O Lines |
|
21
|
| Number of Terminals |
|
28
|
| Number of Timers |
|
7
|
| On Chip Data RAM Width |
|
8
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
|
SSOP28,.3
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, SHRINK PITCH
|
| RAM (words) |
|
16384
|
| ROM Programmability |
|
FLASH
|
| Screening Level |
|
TS 16949
|
| Seated Height-Max |
|
2 mm
|
| Speed |
|
40 MHz
|
| Supply Current-Max |
|
350 mA
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
5.3 mm
|
|
|
|
Compare DSPIC33EV256GM002-M/MM with alternatives
Compare DSPIC33EV256GM002T-I/SS with alternatives