DSPIC33EV128GM004T-H/MR
vs
DSPIC30F5015T-20I/PT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-64
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Package Code |
QFP
|
TFQFP
|
| Technology |
CMOS
|
CMOS
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
64
|
| ECCN Code |
|
3A991.A.2
|
| Additional Feature |
|
ALSO OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
|
16
|
| Clock Frequency-Max |
|
40 MHz
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQFP-G64
|
| JESD-609 Code |
|
e3
|
| Length |
|
10 mm
|
| Moisture Sensitivity Level |
|
3
|
| Number of Terminals |
|
64
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Width |
|
10 mm
|
|
|
|
Compare DSPIC33EV128GM004T-H/MR with alternatives
Compare DSPIC30F5015T-20I/PT with alternatives