DSPIC33EP64MC506-H/MR
vs
DSPIC33EP512MU810T-I/BG
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFN-64
|
TPBGA-121
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
YES
|
| Bit Size |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
60 MHz
|
60 MHz
|
| External Data Bus Width |
|
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
NO
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQCC-N64
|
S-PBGA-B121
|
| JESD-609 Code |
e3
|
e1
|
| Length |
9 mm
|
10 mm
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
4
|
15
|
| Number of External Interrupts |
3
|
5
|
| Number of Terminals |
64
|
121
|
| Number of Timers |
5
|
9
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TFBGA
|
| Package Equivalence Code |
LCC64,.35SQ,20
|
BGA121,11X11,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| RAM (words) |
4096
|
53248
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
1.2 mm
|
| Supply Current-Max |
300 mA
|
320 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
9 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
121
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Number of Serial I/Os |
|
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare DSPIC33EP64MC506-H/MR with alternatives
Compare DSPIC33EP512MU810T-I/BG with alternatives