DSPIC33EP64GS505T-I/Y8
vs
DSPIC33EP64GS502T-I/SO
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TQFP-48
SOIC-28
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
60 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQFP-G48
R-PDSO-G28
Length
7 mm
17.9 mm
Low Power Mode
YES
YES
Number of Terminals
48
28
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFQFP
SOP
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
SMALL OUTLINE
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
TS 16949
Seated Height-Max
1.2 mm
2.65 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Width
7 mm
7.5 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Rohs Code
Yes
Samacsys Manufacturer
Microchip
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
250
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
Compare DSPIC33EP64GS505T-I/Y8 with alternatives
Compare DSPIC33EP64GS502T-I/SO with alternatives