DSPIC33EP64GS505-I/PT
vs
DSPIC33EP64GS502T-E/MX
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-48
|
UQFN-28
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
|
| Bit Size |
16
|
16
|
| Clock Frequency-Max |
60 MHz
|
60 MHz
|
| External Data Bus Width |
|
|
| Internal Bus Architecture |
MULTIPLE
|
|
| JESD-30 Code |
S-PQFP-G48
|
S-PQCC-N28
|
| JESD-609 Code |
e3
|
|
| Length |
7 mm
|
6 mm
|
| Number of Terminals |
48
|
28
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
HVQCCN
|
| Package Equivalence Code |
TQFP48,.35SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
AEC-Q100; TS 16949
|
| Seated Height-Max |
1.2 mm
|
0.55 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
5-CH 12-BIT (S AND H) FOR ADC CONVERTER
|
|
|
|
Compare DSPIC33EP64GS505-I/PT with alternatives
Compare DSPIC33EP64GS502T-E/MX with alternatives