DSPIC33EP512MU810T-I/BG
vs
DSPIC33EP512GM704-E/PF
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
BGA
|
|
Package Description |
TPBGA-121
|
|
Pin Count |
121
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
|
Bit Size |
16
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
60 MHz
|
|
External Data Bus Width |
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
NO
|
|
Internal Bus Architecture |
MULTIPLE
|
|
JESD-30 Code |
S-PBGA-B121
|
|
JESD-609 Code |
e1
|
|
Length |
10 mm
|
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
15
|
|
Number of External Interrupts |
5
|
|
Number of Serial I/Os |
|
|
Number of Terminals |
121
|
|
Number of Timers |
9
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
TFBGA
|
|
Package Equivalence Code |
BGA121,11X11,32
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Qualification Status |
Not Qualified
|
|
RAM (words) |
53248
|
|
ROM Programmability |
FLASH
|
|
Seated Height-Max |
1.2 mm
|
|
Supply Current-Max |
320 mA
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
3 V
|
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
0.8 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
10 mm
|
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DSPIC33EP512MU810T-I/BG with alternatives
Compare DSPIC33EP512GM704-E/PF with alternatives