DSPIC33EP512GM604-E/ML
vs
PIC24EP512GU810-I/BG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
QFN-44
TPBGA-121
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
6 Weeks
4 Weeks
Samacsys Manufacturer
Microchip
Microchip
Address Bus Width
Barrel Shifter
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
60 MHz
External Data Bus Width
Format
FIXED POINT
FLOATING POINT
Integrated Cache
NO
NO
Internal Bus Architecture
MULTIPLE
JESD-30 Code
S-PQCC-N44
S-PBGA-B121
JESD-609 Code
e3
e1
Length
8 mm
10 mm
Low Power Mode
YES
YES
Number of DMA Channels
4
15
Number of External Interrupts
5
5
Number of Serial I/Os
6
Number of Terminals
44
121
Number of Timers
15
9
On Chip Data RAM Width
8
8
On Chip Program ROM Width
24
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TFBGA
Package Equivalence Code
LCC44,.31SQ,25
BGA121,11X11,32
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (words)
49152
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100; TS 16949
Seated Height-Max
1 mm
1.2 mm
Supply Current-Max
60 mA
320 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN SILVER COPPER
Terminal Form
NO LEAD
BALL
Terminal Pitch
0.65 mm
0.8 mm
Terminal Position
QUAD
BOTTOM
Width
8 mm
10 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
MICROCONTROLLER, RISC
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
121
Compare DSPIC33EP512GM604-E/ML with alternatives
Compare PIC24EP512GU810-I/BG with alternatives