DSPIC33EP512GM306T-I/PT vs DSPIC33EP512GM306-E/PT feature comparison

DSPIC33EP512GM306T-I/PT Microchip Technology Inc

Buy Now Datasheet

DSPIC33EP512GM306-E/PT Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description TFQFP, TQFP64,.47SQ TFQFP, TQFP64,.47SQ
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 6 Weeks 6 Weeks
Samacsys Manufacturer Microchip Microchip
Address Bus Width
Barrel Shifter YES YES
Bit Size 16 16
Boundary Scan YES YES
Clock Frequency-Max 60 MHz 60 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e3 e3
Length 10 mm 10 mm
Low Power Mode YES YES
Number of DMA Channels 4 4
Number of External Interrupts 5 5
Number of Serial I/Os 6 6
Number of Terminals 64 64
Number of Timers 15 15
On Chip Data RAM Width 8 8
On Chip Program ROM Width 24 24
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP TQFP
Package Equivalence Code TQFP64,.47SQ TQFP64,.47SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, THIN PROFILE FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
RAM (words) 49152 49152
ROM Programmability FLASH FLASH
Screening Level TS 16949 AEC-Q100; TS 16949
Seated Height-Max 1.2 mm 1.2 mm
Supply Current-Max 60 mA 60 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish MATTE TIN MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1

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