DSPIC33EP32GP503T-E/TL
vs
DSPIC33EP32GS504T-I/ML
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
LCC
Package Description
5 X 5 MM, 0.90 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, VTLA-36
QFN-44
Pin Count
36
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Microchip
Microchip
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
60 MHz
External Data Bus Width
Format
FLOATING POINT
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-XQCC-N36
S-PQCC-N44
JESD-609 Code
e4
e3
Length
5 mm
8 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
1
Number of Terminals
36
44
On Chip Program ROM Width
24
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC36,.20SQ,20
LCC44,.31SQ,25
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
TS 16949
Seated Height-Max
1 mm
1 mm
Supply Current-Max
150 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
MATTE TIN
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
5 mm
8 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Factory Lead Time
6 Weeks
Compare DSPIC33EP32GP503T-E/TL with alternatives
Compare DSPIC33EP32GS504T-I/ML with alternatives