DSPIC33EP16GS502-I/MX
vs
DSPIC33EP32MC502-I/SP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
UQFN-28
1.365 X 0.240 INCH, 0.120 INCH HEIGHT, 0.100 INCH PITCH, LEAD FREE, PLASTIC, SDIP-28
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Microchip
Microchip
Additional Feature
5-CH 12-BIT (S AND H) FOR ADC CONVERTER
Address Bus Width
Bit Size
16
16
Clock Frequency-Max
60 MHz
60 MHz
External Data Bus Width
JESD-30 Code
S-PQCC-N28
R-PDIP-T28
Length
6 mm
34.671 mm
Number of Terminals
28
28
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
DIP
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
IN-LINE
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
TS 16949
Seated Height-Max
0.55 mm
5.08 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
6 mm
7.62 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Rohs Code
Part Package Code
DIP
Pin Count
28
Factory Lead Time
4 Weeks
Barrel Shifter
YES
Boundary Scan
YES
Format
FIXED POINT
Integrated Cache
NO
Internal Bus Architecture
MULTIPLE
JESD-609 Code
e3
Low Power Mode
YES
Number of DMA Channels
4
Number of External Interrupts
3
Number of Timers
5
On Chip Data RAM Width
8
Package Equivalence Code
DIP28,.3
Qualification Status
Not Qualified
RAM (words)
4096
Supply Current-Max
55 mA
Terminal Finish
MATTE TIN
Compare DSPIC33EP16GS502-I/MX with alternatives
Compare DSPIC33EP32MC502-I/SP with alternatives