DSPIC33EP16GS202-E/MM
vs
DSPIC33EP32MC502-I/SP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QFN-28
|
1.365 X 0.240 INCH, 0.120 INCH HEIGHT, 0.100 INCH PITCH, LEAD FREE, PLASTIC, SDIP-28
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
7 Weeks
|
5 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
Additional Feature |
OPERATES UPTO 60MIPS; AEC-Q100 (PLANNED)
|
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
60 MHz
|
60 MHz
|
External Data Bus Width |
|
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQCC-N28
|
R-PDIP-T28
|
JESD-609 Code |
e3
|
e3
|
Length |
6 mm
|
34.671 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
28
|
28
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
DIP
|
Package Equivalence Code |
LCC28,.24SQ,25
|
DIP28,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
5.08 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
6 mm
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
DIP
|
Pin Count |
|
28
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
NO
|
Number of DMA Channels |
|
4
|
Number of External Interrupts |
|
3
|
Number of Timers |
|
5
|
On Chip Data RAM Width |
|
8
|
Qualification Status |
|
Not Qualified
|
RAM (words) |
|
4096
|
Supply Current-Max |
|
55 mA
|
|
|
|
Compare DSPIC33EP16GS202-E/MM with alternatives
Compare DSPIC33EP32MC502-I/SP with alternatives