DSPIC33EP128GP506-H/MR
vs
DSPIC33EP512MC504-I/PT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
QFN-64
10 X 10 MM, 1 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-44
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.A
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Microchip
Microchip
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
60 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQCC-N64
S-PQFP-G44
JESD-609 Code
e3
e3
Length
9 mm
10 mm
Low Power Mode
NO
YES
Number of DMA Channels
4
4
Number of External Interrupts
3
3
Number of Terminals
64
44
Number of Timers
5
5
On Chip Data RAM Width
8
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
150 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TQFP
Package Equivalence Code
LCC64,.35SQ,20
TQFP44,.47SQ,32
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, THIN PROFILE
RAM (words)
16384
49152
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100; TS 16949
TS 16949
Seated Height-Max
1 mm
1.2 mm
Supply Current-Max
60 mA
55 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
MATTE TIN
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.8 mm
Terminal Position
QUAD
QUAD
Width
9 mm
10 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Rohs Code
Factory Lead Time
6 Weeks
Qualification Status
Not Qualified
Compare DSPIC33EP128GP506-H/MR with alternatives
Compare DSPIC33EP512MC504-I/PT with alternatives