DSPIC33EP128GM306T-I/PT
vs
DSPIC33EP256MC504-H/ML
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TFQFP, TQFP64,.47SQ
QFN-44
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A001.A.2.A
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Microchip
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
60 MHz
60 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQFP-G64
S-PQCC-N44
JESD-609 Code
e3
e3
Length
10 mm
8 mm
Low Power Mode
YES
YES
Number of DMA Channels
4
4
Number of External Interrupts
5
3
Number of Serial I/Os
6
Number of Terminals
64
44
Number of Timers
15
5
On Chip Data RAM Width
8
8
On Chip Program ROM Width
24
8
Operating Temperature-Max
85 °C
150 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TQFP
HVQCCN
Package Equivalence Code
TQFP64,.47SQ
LCC44,.32SQ,25
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
RAM (words)
16384
32768
ROM Programmability
FLASH
FLASH
Screening Level
TS 16949
AEC-Q100; TS 16949
Seated Height-Max
1.2 mm
1 mm
Supply Current-Max
60 mA
60 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
10 mm
8 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Compare DSPIC33EP128GM306T-I/PT with alternatives
Compare DSPIC33EP256MC504-H/ML with alternatives