DSPIC33CK64MP208-E/PT
vs
DSPIC33CK256MP606-E/PT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TFQFP, TQFP80,.55SQ
TQFP-64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Factory Lead Time
6 Weeks
4 Weeks
Samacsys Manufacturer
Microchip
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
64 MHz
64 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQFP-G80
S-PQFP-G64
Length
12 mm
10 mm
Low Power Mode
YES
YES
Number of DMA Channels
4
8
Number of External Interrupts
4
4
Number of Serial I/Os
4
Number of Terminals
80
64
Number of Timers
2
1
On Chip Data RAM Width
8
8
On Chip Program ROM Width
24
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFQFP
TFQFP
Package Equivalence Code
QFP80,.55SQ,20
TQFP64,.47SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, THIN PROFILE, FINE PITCH
FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (words)
8192
65536
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1.2 mm
1.2 mm
Supply Current-Max
42.5 mA
42 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
12 mm
10 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn)
Compare DSPIC33CK64MP208-E/PT with alternatives
Compare DSPIC33CK256MP606-E/PT with alternatives