DSPIC33CK512MP308T-I/PT
vs
DSPIC33CK256MP605T-I/M7
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TQFP-80
|
VQFN-48
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Address Bus Width |
|
|
| Barrel Shifter |
YES
|
YES
|
| Bit Size |
16
|
16
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
64 MHz
|
64 MHz
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQCC-N48
|
| Length |
12 mm
|
6 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
8
|
8
|
| Number of External Interrupts |
4
|
4
|
| Number of Terminals |
80
|
48
|
| Number of Timers |
1
|
1
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
HVQCCN
|
| Package Equivalence Code |
TQFP80,.55SQ
|
LCC48,.24SQ,16
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| RAM (words) |
65536
|
65536
|
| ROM Programmability |
FLASH
|
FLASH
|
| Screening Level |
TS 16949
|
TS 16949
|
| Seated Height-Max |
1.2 mm
|
0.9 mm
|
| Supply Current-Max |
42 mA
|
35 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e3
|
| Number of Serial I/Os |
|
3
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare DSPIC33CK512MP308T-I/PT with alternatives
Compare DSPIC33CK256MP605T-I/M7 with alternatives