DSPIC33CK32MP506E/MR
vs
DSPIC33CK32MP506I/PT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
HVQCCN, LCC64,.35SQ,20
TFQFP, TQFP64,.47SQ
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Date Of Intro
2018-07-30
2018-07-30
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
64 MHz
64 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQCC-N64
S-PQFP-G64
JESD-609 Code
e3
e3
Length
9 mm
10 mm
Low Power Mode
YES
YES
Number of DMA Channels
4
4
Number of External Interrupts
4
4
Number of Serial I/Os
4
4
Number of Terminals
64
64
Number of Timers
2
2
On Chip Data RAM Width
8
8
On Chip Program ROM Width
24
24
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TFQFP
Package Equivalence Code
LCC64,.35SQ,20
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, THIN PROFILE, FINE PITCH
RAM (words)
8192
8192
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100
TS 16949
Seated Height-Max
1 mm
1.2 mm
Supply Current-Max
42.5 mA
35 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Matte Tin (Sn)
Matte Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
9 mm
10 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Compare DSPIC33CK32MP506E/MR with alternatives
Compare DSPIC33CK32MP506I/PT with alternatives