DSPIC33CK32MP206-E/MR
vs
DSPIC33CK256MP506T-E/PTVAO
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
HVQCCN, LCC64,.35SQ,20
TQFP-64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Factory Lead Time
9 Weeks
Samacsys Manufacturer
Microchip
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
64 MHz
64 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
Internal Bus Architecture
MULTIPLE
MULTIPLE
JESD-30 Code
S-PQCC-N64
S-PQFP-G64
Length
9 mm
10 mm
Low Power Mode
YES
YES
Number of DMA Channels
4
4
Number of External Interrupts
4
4
Number of Serial I/Os
4
Number of Terminals
64
64
Number of Timers
2
11
On Chip Data RAM Width
8
8
On Chip Program ROM Width
24
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TFQFP
Package Equivalence Code
LCC64,.35SQ,20
TQFP64,.47SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (words)
8192
24576
ROM Programmability
FLASH
FLASH
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
1 mm
1.2 mm
Supply Current-Max
42.5 mA
300 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
9 mm
10 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn)
Compare DSPIC33CK32MP206-E/MR with alternatives
Compare DSPIC33CK256MP506T-E/PTVAO with alternatives