DSPIC33CK32MC102-H/SS vs DSPIC33CK256MP206I/MR feature comparison

DSPIC33CK32MC102-H/SS Microchip Technology Inc

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DSPIC33CK256MP206I/MR Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description SSOP-28 HVQCCN, LCC64,.35SQ,20
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Date Of Intro 2020-08-12 2018-07-30
Address Bus Width
Barrel Shifter YES YES
Bit Size 16 16
Boundary Scan YES YES
Clock Frequency-Max 64 MHz 64 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code R-PDSO-G28 S-PQCC-N64
Length 10.2 mm 9 mm
Low Power Mode YES YES
Number of DMA Channels 4 4
Number of External Interrupts 4 4
Number of Serial I/Os 3 4
Number of Terminals 28 64
Number of Timers 3 2
On Chip Data RAM Width 8 8
On Chip Program ROM Width 24 24
Operating Temperature-Max 150 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP HVQCCN
Package Equivalence Code SSOP28,.3 LCC64,.35SQ,20
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
RAM (words) 8192 24576
ROM Programmability FLASH FLASH
Screening Level AEC-Q100 TS 16949
Seated Height-Max 2 mm 1 mm
Supply Current-Max 29.6 mA 35 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Width 5.3 mm 9 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 1 1
Rohs Code No
Samacsys Manufacturer Microchip
JESD-609 Code e3
Terminal Finish Matte Tin (Sn)

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