DSPIC33CK256MP506-E/MR vs DSPIC33CK256MP605-I/PT feature comparison

DSPIC33CK256MP506-E/MR Microchip Technology Inc

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DSPIC33CK256MP605-I/PT Microchip Technology Inc

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Rohs Code Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description QFN-64 TQFP-48
Reach Compliance Code compliant compliant
Factory Lead Time 9 Weeks 6 Weeks
Samacsys Manufacturer Microchip
Address Bus Width
Barrel Shifter YES YES
Bit Size 16 16
Boundary Scan YES YES
Clock Frequency-Max 64 MHz 64 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQCC-N64 S-PQFP-G48
JESD-609 Code e3 e3
Length 9 mm 7 mm
Low Power Mode YES YES
Number of DMA Channels 4 8
Number of External Interrupts 4 4
Number of Serial I/Os 4 3
Number of Terminals 64 48
Number of Timers 2 1
On Chip Data RAM Width 8 8
On Chip Program ROM Width 24 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN TFQFP
Package Equivalence Code LCC64,.35SQ,20 TQFP48,.35SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLATPACK, THIN PROFILE, FINE PITCH
RAM (words) 24576 65536
ROM Programmability FLASH FLASH
Screening Level AEC-Q100 TS 16949
Seated Height-Max 1 mm 1.2 mm
Supply Current-Max 42.5 mA 35 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Matte Tin (Sn) Matte Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 9 mm 7 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches 2 1

Compare DSPIC33CK256MP506-E/MR with alternatives

Compare DSPIC33CK256MP605-I/PT with alternatives