DSPIC33CH512MP508-I/MR
vs
DSPIC33CH512MP508TI/PT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
,
|
TFQFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Package Code |
QFP
|
TFQFP
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A991.A.2
|
| Date Of Intro |
|
2018-11-15
|
| Additional Feature |
|
IT ALSO HAS SLAVE CORE OPERATES AT 200 MHZ WITH 73728 BYTES OF PRAM AND 16384 BYTES OF DATA RAM
|
| Address Bus Width |
|
|
| Barrel Shifter |
|
YES
|
| Bit Size |
|
16
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
64 MHz
|
| External Data Bus Width |
|
|
| Internal Bus Architecture |
|
MULTIPLE
|
| JESD-30 Code |
|
S-PQFP-G80
|
| JESD-609 Code |
|
e3
|
| Length |
|
12 mm
|
| Low Power Mode |
|
YES
|
| Number of Terminals |
|
80
|
| On Chip Program ROM Width |
|
8
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
|
TQFP80,.55SQ
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max |
|
3.6 V
|
| Supply Voltage-Min |
|
3 V
|
| Supply Voltage-Nom |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
12 mm
|
|
|
|
Compare DSPIC33CH512MP508-I/MR with alternatives
Compare DSPIC33CH512MP508TI/PT with alternatives