DSPIC33CH512MP508-H/PT
vs
DSPIC33CH512MP508-I/MR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TFQFP, TQFP80,.55SQ
,
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.A
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
Microchip
Additional Feature
16kbytes slave core Ram available
Address Bus Width
Barrel Shifter
YES
Bit Size
16
Boundary Scan
YES
Clock Frequency-Max
64 MHz
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
Internal Bus Architecture
MULTIPLE
JESD-30 Code
S-PQFP-G80
JESD-609 Code
e3
Length
12 mm
Low Power Mode
YES
Number of DMA Channels
8
Number of External Interrupts
3
Number of Serial I/Os
2
Number of Terminals
80
Number of Timers
6
On Chip Data RAM Width
8
On Chip Program ROM Width
24
Operating Temperature-Max
150 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
TQFP
QFP
Package Equivalence Code
TQFP80,.55SQ
Package Shape
SQUARE
Package Style
FLATPACK, THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (words)
49152
ROM Programmability
FLASH
Seated Height-Max
1.2 mm
Supply Current-Max
98 mA
Supply Voltage-Max
3.6 V
Supply Voltage-Min
3 V
Supply Voltage-Nom
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Terminal Form
GULL WING
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
12 mm
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
1
1
Compare DSPIC33CH512MP508-H/PT with alternatives
Compare DSPIC33CH512MP508-I/MR with alternatives