DSPIC33CH256MP506T-I/PT
vs
DSPIC33CH256MP506TE/MR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TFQFP, TQFP64,.47SQ
HVQCCN, LCC64,.35SQ,20
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
Microchip
Address Bus Width
Barrel Shifter
YES
YES
Bit Size
16
16
Boundary Scan
YES
YES
Clock Frequency-Max
64 MHz
64 MHz
External Data Bus Width
Internal Bus Architecture
MULTIPLE
MULTIPLE
Low Power Mode
YES
YES
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Code
QFP
HVQCCN
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
uPs/uCs/Peripheral ICs Type
DIGITAL SIGNAL PROCESSOR, CONTROLLER
DIGITAL SIGNAL PROCESSOR, CONTROLLER
Base Number Matches
2
2
Date Of Intro
2018-11-15
Additional Feature
16kbytes slave core Ram available
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQCC-N64
JESD-609 Code
e3
Length
9 mm
Number of DMA Channels
8
Number of External Interrupts
3
Number of Serial I/Os
2
Number of Terminals
64
Number of Timers
6
On Chip Data RAM Width
8
On Chip Program ROM Width
24
Package Body Material
PLASTIC/EPOXY
Package Equivalence Code
LCC64,.35SQ,20
Package Shape
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
RAM (words)
32768
ROM Programmability
FLASH
Screening Level
AEC-Q100
Seated Height-Max
1 mm
Supply Current-Max
98 mA
Surface Mount
YES
Technology
CMOS
Terminal Finish
Matte Tin (Sn)
Terminal Form
NO LEAD
Terminal Pitch
0.5 mm
Terminal Position
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
9 mm
Compare DSPIC33CH256MP506T-I/PT with alternatives
Compare DSPIC33CH256MP506TE/MR with alternatives