DSPIC30F5015-20I/PF
vs
DSPIC30F5015-20E/PF
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
14 X 14 MM, 1 MM HEIGHT, MS-026, PLASTIC, TQFP-64
|
14 X 14 MM, 1 MM HEIGHT, MS-026, PLASTIC, TQFP-64
|
Pin Count |
64
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ
|
OPERATES AT 2.5V MINIMUM SUPPLY AT 7.5 MHZ
|
Address Bus Width |
|
|
Bit Size |
16
|
16
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e3
|
e3
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Terminals |
64
|
64
|
On Chip Program ROM Width |
24
|
24
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TQFP
|
TQFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, THIN PROFILE
|
FLATPACK, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DSPIC30F5015-20I/PF with alternatives
Compare DSPIC30F5015-20E/PF with alternatives