DSPIC30F2011BT-30E/MM
vs
DSPIC30F2011CT-30ISO-ES
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
SOIC
|
Package Description |
6 X 6 MM, 0.90 MM HEIGHT, PLASTIC, QFN-28
|
0.300 INCH, PLASTIC, MS-013, SOIC-18
|
Pin Count |
28
|
18
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
YES
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
|
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQCC-N28
|
R-PDSO-G18
|
Length |
6 mm
|
11.53 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
28
|
18
|
On Chip Program ROM Width |
24
|
24
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
SOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
2.64 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
2.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
6 mm
|
7.49 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
JESD-609 Code |
|
e3
|
Moisture Sensitivity Level |
|
1
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare DSPIC30F2011BT-30E/MM with alternatives
Compare DSPIC30F2011CT-30ISO-ES with alternatives