DSPIC30F2011AT-30IML-ES
vs
DSPIC30F2011BT-30I/P
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
DIP
|
Package Description |
8 X 8 MM, PLASTIC, QFN-44
|
0.300 INCH, PLASTIC, DIP-18
|
Pin Count |
44
|
18
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
|
|
Barrel Shifter |
YES
|
YES
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
NO
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
External Data Bus Width |
|
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PQCC-N44
|
R-PDIP-T18
|
JESD-609 Code |
e3
|
|
Length |
8 mm
|
22.86 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
1
|
|
Number of Terminals |
44
|
18
|
On Chip Program ROM Width |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VQCCN
|
DIP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
|
ROM Programmability |
FLASH
|
FLASH
|
Screening Level |
TS 16949
|
TS 16949
|
Seated Height-Max |
1 mm
|
5.334 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.5 V
|
2.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn)
|
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
0.65 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Width |
8 mm
|
7.62 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DSPIC30F2011AT-30IML-ES with alternatives
Compare DSPIC30F2011BT-30I/P with alternatives