DSP56852VF120
vs
DSP56852VFE
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
LFBGA,
|
MAPBGA-81
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Date Of Intro |
2016-08-12
|
2016-08-12
|
Address Bus Width |
20
|
20
|
Barrel Shifter |
YES
|
YES
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
240 MHz
|
240 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B81
|
S-PBGA-B81
|
Length |
8 mm
|
8 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
81
|
81
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Seated Height-Max |
1.3 mm
|
1.3 mm
|
Supply Voltage-Max |
1.98 V
|
1.98 V
|
Supply Voltage-Min |
1.62 V
|
1.62 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
8 mm
|
8 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
DIGITAL SIGNAL PROCESSOR, CONTROLLER
|
Base Number Matches |
4
|
2
|
Factory Lead Time |
|
4 Weeks
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|