DSP56309PV100 vs XC56303GC100 feature comparison

DSP56309PV100 Motorola Mobility LLC

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XC56303GC100 Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Part Package Code QFP
Package Description LFQFP, QFP144,.87SQ,20 BGA, BGA196,14X14,40
Pin Count 144
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 18 18
Barrel Shifter YES YES
Bit Size 24 24
Boundary Scan YES YES
Clock Frequency-Max 100 MHz 100 MHz
External Data Bus Width 24 24
Format FIXED POINT FIXED POINT
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G144 S-PBGA-B196
Length 20 mm 15 mm
Low Power Mode YES YES
Number of Terminals 144 196
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP BGA
Package Equivalence Code QFP144,.87SQ,20 BGA196,14X14,40
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
Qualification Status Not Qualified Not Qualified
RAM (words) 14336 3072
Seated Height-Max 1.6 mm 1.91 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 20 mm 15 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1
Rohs Code No
Integrated Cache NO
JESD-609 Code e0
Number of DMA Channels 6
Number of External Interrupts 5
Number of Serial I/Os 3
Number of Timers 3
On Chip Data RAM Width 24
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Supply Current-Max 181 mA
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD

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Compare XC56303GC100 with alternatives