DSP56309PV100
vs
DSP56303FV100
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP, QFP144,.87SQ,20
|
MOLD ARRAY PROCESS, BGA-196
|
| Pin Count |
144
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
18
|
18
|
| Barrel Shifter |
YES
|
YES
|
| Bit Size |
24
|
24
|
| Boundary Scan |
YES
|
NO
|
| Clock Frequency-Max |
100 MHz
|
100 MHz
|
| External Data Bus Width |
24
|
24
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PQFP-G144
|
S-PBGA-B196
|
| Length |
20 mm
|
15 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
144
|
196
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LBGA
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
BGA196,14X14,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
14336
|
4096
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
20 mm
|
15 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare DSP56309PV100 with alternatives
Compare DSP56303FV100 with alternatives