DSP56304PV66 vs XC56303GC66 feature comparison

DSP56304PV66 Motorola Mobility LLC

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XC56303GC66 Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MOTOROLA INC
Part Package Code QFP BGA
Package Description LFQFP, QFP144,.87SQ,20 BGA, BGA196,14X14,40
Pin Count 144 196
Reach Compliance Code unknown unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 18 18
Barrel Shifter YES YES
Bit Size 24 24
Boundary Scan YES YES
Clock Frequency-Max 66 MHz 66 MHz
External Data Bus Width 24 24
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
Internal Bus Architecture MULTIPLE MULTIPLE
JESD-30 Code S-PQFP-G144 S-PBGA-B196
JESD-609 Code e0 e0
Length 20 mm 15 mm
Low Power Mode YES YES
Number of DMA Channels 6 6
Number of External Interrupts 5 5
Number of Serial I/Os 2 3
Number of Terminals 144 196
Number of Timers 3 3
On Chip Data RAM Width 24 24
On Chip Program ROM Width 24
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP BGA
Package Equivalence Code QFP144,.87SQ,20 BGA196,14X14,40
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
Qualification Status Not Qualified Not Qualified
RAM (words) 5020 3072
ROM Programmability MROM
Seated Height-Max 1.6 mm 1.91 mm
Supply Current-Max 120 mA 120 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 20 mm 15 mm
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches 1 1

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