DSP56301VF80
vs
DSP56301VF80
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Package Description |
MOLD ARRAY PROCESS, BGA-252
|
BGA, BGA252,16X16,50
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
24
|
| Barrel Shifter |
YES
|
YES
|
| Bit Size |
24
|
24
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
80 MHz
|
80 MHz
|
| External Data Bus Width |
24
|
24
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
| JESD-30 Code |
S-PBGA-B252
|
S-PBGA-B252
|
| Length |
21 mm
|
21 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
252
|
252
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA252,16X16,50
|
BGA252,16X16,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
4096
|
4096
|
| Seated Height-Max |
1.9 mm
|
1.9 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
21 mm
|
21 mm
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
252
|
|
|
|
Compare DSP56301VF80 with alternatives
Compare DSP56301VF80 with alternatives