DSP56301PW100
vs
DSP56301VL80
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
PLASTIC, TQFP-208
|
,
|
| Pin Count |
208
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
24
|
|
| Barrel Shifter |
YES
|
|
| Bit Size |
24
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
100 MHz
|
|
| External Data Bus Width |
24
|
|
| Format |
FIXED POINT
|
|
| Internal Bus Architecture |
MULTIPLE
|
|
| JESD-30 Code |
S-PQFP-G208
|
|
| JESD-609 Code |
e0
|
|
| Length |
28 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
208
|
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LFQFP
|
|
| Package Equivalence Code |
QFP208,1.2SQ,20
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
|
| Peak Reflow Temperature (Cel) |
220
|
260
|
| Qualification Status |
Not Qualified
|
|
| RAM (words) |
4096
|
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
28 mm
|
|
| uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER
|
DIGITAL SIGNAL PROCESSOR, OTHER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare DSP56301PW100 with alternatives
Compare DSP56301VL80 with alternatives