DSC2311KL1-R0009
vs
DSC2211FI1-E0021
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
TDFN-6
QFN-14
Reach Compliance Code
compliant
compliant
JESD-30 Code
R-PDSO-N6
R-PQCC-N14
JESD-609 Code
e4
e4
Length
2.5 mm
3.2 mm
Moisture Sensitivity Level
1
1
Number of Terminals
6
14
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Clock Frequency-Max
25 MHz
6.9 MHz
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
HVQCCN
Package Equivalence Code
SOLCC6,.08,32
LCC14,.1X.12,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
260
Screening Level
AEC-Q100
AEC-Q100
Seated Height-Max
0.9 mm
0.95 mm
Supply Current-Max
23 mA
23 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.825 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
2 mm
2.5 mm
uPs/uCs/Peripheral ICs Type
CLOCK GENERATOR, MEMS
CLOCK GENERATOR, MEMS
Base Number Matches
2
2
Additional Feature
MEMS clock generators
Compare DSC2311KL1-R0009 with alternatives
Compare DSC2211FI1-E0021 with alternatives