DSB5712E3
vs
JANKCA1N5712
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
ROHS COMPLIANT, HERMETIC SEALED, DO-35, GLASS PACKAGE-2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.70
Additional Feature
HIGH RELIABILITY
METALLURGICALLY BONDED
Application
GENERAL PURPOSE
GENERAL PURPOSE
Case Connection
ISOLATED
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
JEDEC-95 Code
DO-204AH
JESD-30 Code
O-LALF-W2
S-XUUC-N2
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
Operating Temperature-Min
-65 °C
Output Current-Max
0.075 A
0.075 A
Package Body Material
GLASS
UNSPECIFIED
Package Shape
ROUND
SQUARE
Package Style
LONG FORM
UNCASED CHIP
Rep Pk Reverse Voltage-Max
16 V
Surface Mount
NO
YES
Technology
SCHOTTKY
Terminal Form
WIRE
NO LEAD
Terminal Position
AXIAL
UPPER
Base Number Matches
1
4
Rohs Code
JESD-609 Code
e0
Qualification Status
Qualified
Terminal Finish
Tin/Lead (Sn/Pb)
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