DS80C310-MCG vs TD87C52-2 feature comparison

DS80C310-MCG Dallas Semiconductor

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TD87C52-2 Intel Corporation

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer DALLAS SEMICONDUCTOR INTEL CORP
Package Description 0.600 INCH, PLASTIC, DIP-40 DIP, DIP40,.6
Reach Compliance Code unknown compliant
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 25 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-GDIP-T40
JESD-609 Code e0
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
ROM Programmability MROM UVPROM
Speed 25 MHz 12 MHz
Supply Voltage-Max 5.5 V 6 V
Supply Voltage-Min 4 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 1
Part Package Code DIP
Pin Count 40
HTS Code 8542.31.00.01
Additional Feature BOOLEAN PROCESSOR; ON-CIRCUIT EMULATION
Boundary Scan NO
Format FIXED POINT
Integrated Cache NO
Length 52.325 mm
Low Power Mode YES
Number of DMA Channels
Number of External Interrupts 2
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8
On Chip Program ROM Width 8
RAM (words) 256
ROM (words) 8192
Seated Height-Max 5.72 mm
Supply Current-Max 30 mA
Width 15.24 mm

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