DS80C310-MCG vs SAB80C52-20-P feature comparison

DS80C310-MCG Dallas Semiconductor

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SAB80C52-20-P Infineon Technologies AG

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer DALLAS SEMICONDUCTOR INFINEON TECHNOLOGIES AG
Package Description 0.600 INCH, PLASTIC, DIP-40 PLASTIC, DIP-40
Reach Compliance Code unknown not_compliant
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 25 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
JESD-609 Code e0 e0
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP40,.6 DIP40,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
ROM Programmability MROM MROM
Speed 25 MHz 20 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 2
Part Package Code DIP
Pin Count 40
HTS Code 8542.31.00.01
Boundary Scan NO
Length 50.9 mm
On Chip Program ROM Width 8
ROM (words) 8192
Seated Height-Max 5.1 mm
Supply Current-Max 33 mA
Width 15.24 mm

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