DS80C310-MCG+
vs
P80C32-25
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
TEMIC SEMICONDUCTORS
Part Package Code
DIP
Package Description
0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-40
Pin Count
40
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
16
16
Bit Size
8
8
CPU Family
8051
8051
Clock Frequency-Max
25 MHz
25 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
JESD-609 Code
e3
e0
Length
52.075 mm
Moisture Sensitivity Level
1
Number of I/O Lines
32
32
Number of Terminals
40
40
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
NO
NO
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP40,.6
DIP40,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
256
256
ROM Programmability
MROM
ROM LESS
Seated Height-Max
5.08 mm
Speed
25 MHz
25 MHz
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
4 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
15.24 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
3
12
Boundary Scan
NO
ROM (words)
0
Supply Current-Max
36.25 mA
Compare DS80C310-MCG+ with alternatives
Compare P80C32-25 with alternatives