DS34T108GN+
vs
DS26518G+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA484,22X22,40
|
17 X 17 MM, 1 MM, PITCH, ROHS COMPLIANT, CSBGA-256
|
Pin Count |
484
|
256
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B484
|
S-XBGA-B256
|
JESD-609 Code |
e1
|
e1
|
Length |
23 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
484
|
256
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA484,22X22,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.41 mm
|
1.76 mm
|
Supply Current-Max |
0.55 mA
|
450 mA
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
23 mm
|
17 mm
|
Base Number Matches |
2
|
1
|
Carrier Type |
|
CEPT PCM-30/E-1
|
Carrier Type (2) |
|
T-1(DS1)
|
|
|
|
Compare DS34T108GN+ with alternatives
Compare DS26518G+ with alternatives