DS34T101GN+
vs
MT9072AV2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROSEMI CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA484,22X22,40
|
17 X 17 MM, 1.30 MM HEIGHT, LEAD FREE, PLASTIC, MO-192, LBGA-220
|
| Pin Count |
484
|
220
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B220
|
| JESD-609 Code |
e1
|
e1
|
| Length |
23 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
8
|
| Number of Terminals |
484
|
220
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Equivalence Code |
BGA484,22X22,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.41 mm
|
1.5 mm
|
| Supply Current-Max |
115 mA
|
|
| Supply Voltage-Nom |
1.8 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
23 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare DS34T101GN+ with alternatives
Compare MT9072AV2 with alternatives