DS3170N
vs
DS2155GNC2+
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
11 X 11 MM, 1.40 MM THICKNESS, 1 MM PITCH, CSBGA-100
|
10 X 10 MM, ROHS COMPLIANT, CSBGA-100
|
Pin Count |
100
|
100
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
JESD-609 Code |
e0
|
e1
|
Length |
11 mm
|
10 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
FBGA
|
Package Equivalence Code |
BGA100,10X10,40
|
BGA100,10X10,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
|
Supply Current-Max |
145 mA
|
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
11 mm
|
10 mm
|
Base Number Matches |
3
|
3
|
Carrier Type |
|
CEPT PCM-30/E-1
|
Carrier Type (2) |
|
T-1(DS1)
|
|
|
|
Compare DS3170N with alternatives
Compare DS2155GNC2+ with alternatives