DS3170
vs
DS2155GNC2+
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
11 X 11 MM, 1.40 MM THICKNESS, 1 MM PITCH, CSBGA-100
|
10 X 10 MM, ROHS COMPLIANT, CSBGA-100
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B100
|
S-PBGA-B100
|
| JESD-609 Code |
e0
|
e1
|
| Length |
11 mm
|
10 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
FBGA
|
| Package Equivalence Code |
BGA100,10X10,40
|
BGA100,10X10,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.5 mm
|
|
| Supply Current-Max |
145 mA
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
11 mm
|
10 mm
|
| Base Number Matches |
1
|
1
|
| Carrier Type |
|
CEPT PCM-30/E-1
|
| Carrier Type (2) |
|
T-1(DS1)
|
|
|
|
Compare DS3170 with alternatives
Compare DS2155GNC2+ with alternatives