DS3164N+
vs
DS3184
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400
|
27 X 27 MM, 1.27 MM PITCH, CSBGA-400
|
Pin Count |
400
|
400
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Applications |
ATM; SDH; SONET
|
ATM; SDH; SONET
|
JESD-30 Code |
S-PBGA-B400
|
S-PBGA-B400
|
JESD-609 Code |
e1
|
e0
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
400
|
400
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA400,20X20,50
|
BGA400,20X20,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
2.54 mm
|
Supply Current-Max |
0.468 mA
|
0.85 mA
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
ATM/SONET/SDH NETWORK INTERFACE
|
ATM/SONET/SDH NETWORK INTERFACE
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
2
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
4 Weeks
|
|
|
|
Compare DS3164N+ with alternatives
Compare DS3184 with alternatives