DS31407GN2
vs
DS31400GN
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| Samacsys Manufacturer |
Microchip
|
|
| Family |
DS31
|
|
| Input Conditioning |
DIFFERENTIAL
|
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
17 mm
|
17 mm
|
| Logic IC Type |
PLL BASED CLOCK DRIVER
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
256
|
256
|
| Number of True Outputs |
4
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-DRAIN
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Power Supply Current-Max (ICC) |
416 mA
|
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Supply Voltage-Max (Vsup) |
1.98 V
|
|
| Supply Voltage-Min (Vsup) |
1.62 V
|
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
17 mm
|
17 mm
|
| fmax-Min |
0.002 MHz
|
|
| Base Number Matches |
1
|
3
|
| Part Package Code |
|
BGA
|
| Package Description |
|
17 X 17 MM, CSBGA-256
|
| Pin Count |
|
256
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Nom |
|
1.8 V
|
| Telecom IC Type |
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare DS31407GN2 with alternatives
Compare DS31400GN with alternatives