DS3134
vs
DS21FT44
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
27 X 27 MM, PLASTIC, BGA-256
|
BGA,
|
Pin Count |
256
|
300
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
4 Weeks
|
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B300
|
JESD-609 Code |
e0
|
|
Length |
27 mm
|
27 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
256
|
300
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
2.34 mm
|
2.54 mm
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Telecom IC Type |
FRAMER
|
FRAMER
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
NOT SPECIFIED
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
3
|
3
|
Pbfree Code |
|
No
|
Moisture Sensitivity Level |
|
4
|
Peak Reflow Temperature (Cel) |
|
240
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare DS3134 with alternatives